Skip to content

TECHNOLOGY

Process & Interface

Binder-free direct bonding and the integrated coating process.

INTERFACE LOGIC

Interface Logic Toward Binder-Free Direct Bonding

Conventional coatings may face peeling or micro-cracking risks at primer or binder interfaces. SAMUON is positioned toward direct bonding or fusion between the substrate and functional inorganic layer, subject to substrate-specific surface preparation, thermal conditions, and interface validation.

What it means: a bond direction that does not rely on a binder interface lets you review reduced delamination risk (per-use validation required).

  • Substrate
  • Functional inorganic layer
  • No binder layer
  • Direct interface
  • Validation checkpoints
Functional inorganic layer Substrate No binder · direct interface

PROCESS

SAMUON Integrated Coating Process

  1. 1

    Surface Preparation

    • · Cleaning
    • · Plasma treatment
    • · Surface-energy tuning
  2. 2

    Coating Application

    • · Spray: large/curved areas
    • · Dip: shelves, grills, separable parts
    • · Vacuum deposition: thin, robust films
  3. 3

    Curing / Stabilization

    • · Room temp
    • · UV
    • · Mid-temp oven (per environment)
  4. 4

    Quality Control

    • · Adhesion (ASTM D3359/D4541)
    • · Antibacterial/antifungal
    • · Chemical
    • · Appearance
    • · Leaching
  5. 5

    Product Integration

    • · OEM/ODM
    • · Licensing
    • · Co-development
    • · Component supply
    • · Co-branding

※ ASTM D7334 assesses wettability/contact angle; direct adhesion is validated with ASTM D3359 or D4541, etc.

EXPLORE

More in this section