TECHNOLOGY

Fusion · No-Delamination Interface

Delamination is not accidental. SAMUON removes the binder and replaces the interface with chemical fusion to reduce its three root causes at once.

Delamination is not accidental. It arises from weak interfaces, pores and micro-cracks, and binder degradation. SAMUON removes the binder, replaces physical adhesion with chemical fusion at the interface, and targets a pore-free, crack-resistant structure to reduce these three causes at once.

Quantitative reliability for each application depends on substrate, process, use environment and test conditions, and is confirmed through application-specific validation.

Conventional coating

Substrate + primer/binder + multilayer
Two or more interfaces
Degradation potential
Delamination risk

SAMUON

Substrate ↔ fused single layer
No binder
Reduced interface risk
Single-pass process potential

Three root causes of delamination

Delamination is structural

01

Weak interface

Physical adhesion between dissimilar phases has limited bond strength and is vulnerable to stress and impact.

02

Pores & micro-cracks

Pores and micro-cracks in multilayer/binder structures become paths for moisture, heat and stress to penetrate.

03

Binder degradation

Organic binders degrade over time under heat/chemical exposure, weakening the interface.

Structural failure modes designed out

Failure modes SAMUON designs out

Interfacial delamination

Removing the binder interface structurally cuts off the main delamination path.

Interlayer separation

Targeting a fused single layer instead of stacked multilayers reduces interlayer-separation risk.

Binder-degradation cracking

With no organic binder, cracking paths originating from binder degradation are reduced.

Evidence access

SEM · Evidence access

Cross-section SEM, test reports and detailed conditions are provided in stages by evidence access level. The cross-sections on this page are concept diagrams; actual SEM evidence is available per the levels below.

1 Public summary: concept diagrams & qualitative description
2 On request: test items & condition summaries
3 After NDA: cross-section SEM & detailed test reports

PoC validation flow

Applicability is confirmed through PoC

STEP 1 Define conditions Substrate, environment, target performance
STEP 2 Prepare samples Use-case coupons prepared
STEP 3 Test & analyze Testing and cross-section/interface analysis
STEP 4 Review & decide Review results, decide on deployment

Request Evidence Package Request a PoC consult View SEM evidence after NDA

INTERFACE LOGIC

Interface Logic Toward Binder-Free Direct Bonding

Conventional coatings may face peeling or micro-cracking risks at primer or binder interfaces. SAMUON is positioned toward direct bonding or fusion between the substrate and functional inorganic layer, subject to substrate-specific surface preparation, thermal conditions, and interface validation.

What it means: a bond direction that does not rely on a binder interface lets you review reduced delamination risk (per-use validation required).

Substrate
Functional inorganic layer
No binder layer
Direct interface
Validation checkpoints

Functional inorganic layer Substrate No binder · direct interface

PROCESS

SAMUON Integrated Coating Process

1
Surface Preparation
- · Cleaning
- · Plasma treatment
- · Surface-energy tuning
2
Coating Application
- · Spray: large/curved areas
- · Dip: shelves, grills, separable parts
- · Vacuum deposition: thin, robust films
3
Curing / Stabilization
- · Room temp
- · UV
- · Mid-temp oven (per environment)
4
Quality Control
- · Adhesion (ASTM D3359/D4541)
- · Antibacterial/antifungal
- · Chemical
- · Appearance
- · Leaching
5
Product Integration
- · OEM/ODM
- · Licensing
- · Co-development
- · Component supply
- · Co-branding

※ ASTM D7334 assesses wettability/contact angle; direct adhesion is validated with ASTM D3359 or D4541, etc.

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